Invention Application
US20100230146A1 CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME
审中-公开
包含CNTS的电路层及其制造方法
- Patent Title: CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 包含CNTS的电路层及其制造方法
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Application No.: US12544959Application Date: 2009-08-20
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Publication No.: US20100230146A1Publication Date: 2010-09-16
- Inventor: Eung Suek LEE , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jee Soo Mok
- Applicant: Eung Suek LEE , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jee Soo Mok
- Priority: KR10-2009-0020315 20090310
- Main IPC: H05K1/09
- IPC: H05K1/09 ; C25D5/02
Abstract:
Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.
Information query
