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公开(公告)号：US20090017275A1
公开(公告)日：2009-01-15
申请号：US12076428
申请日：2008-03-18
Applicant: Eung-Suek Lee , Je-Gwang Yoo , Chang-Sup Ryu , Jun-Oh Hwang , Jee-Soo Mok
Inventor： Eung-Suek Lee , Je-Gwang Yoo , Chang-Sup Ryu , Jun-Oh Hwang , Jee-Soo Mok
CPC classification number: H05K3/4069 , B82Y10/00 , H05K1/0206 , H05K1/0209 , H05K3/06 , H05K3/249 , H05K3/427 , H05K3/4614 , H05K3/4647 , H05K2201/026 , H05K2201/0347 , H05K2201/035 , H05K2201/096 , Y10T428/24851
Abstract: A heat-releasing PCB and a method of manufacturing the PCB are disclosed. The method of manufacturing the heat-releasing printed circuit board includes: preparing a copper clad laminate, which has at least one copper layer stacked on at least one insulation layer; forming a coating layer, made from a paste having carbon nanotubes as a major constituent, on a surface of the copper layer; and forming a circuit pattern by removing portions of the coating layer and portions of the copper layer.
Abstract translation: 公开了一种散热PCB及其制造方法。 制造散热型印刷电路板的方法包括：制备覆铜层压板，其具有至少一层铜层，堆叠在至少一层绝缘层上; 在铜层的表面上形成由具有碳纳米管作为主要成分的浆料制成的涂层; 以及通过去除涂层的一部分和铜层的一部分来形成电路图案。
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公开(公告)号：US08166647B2
公开(公告)日：2012-05-01
申请号：US12352090
申请日：2009-01-12
Applicant: Jun-Oh Hwang , Jee-Soo Mok , Jun-Heyoung Park , Kyung-Ah Lee , Eung-Suek Lee
Inventor： Jun-Oh Hwang , Jee-Soo Mok , Jun-Heyoung Park , Kyung-Ah Lee , Eung-Suek Lee
IPC: H05K3/02
CPC classification number: B82Y10/00 , H05K1/0206 , H05K1/056 , H05K1/183 , H05K3/005 , H05K3/4069 , H05K3/4608 , H05K3/4647 , H05K3/4652 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/0394 , H05K2203/0108 , H05K2203/1131 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165
Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.
Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 该方法可以包括 提供绝缘层，其中第一金属层形成在绝缘层的一侧上; 在绝缘层上形成凹槽; 在所述槽的内侧和所述绝缘层的另一侧上形成金属物质; 以及通过去除所述第一金属层的一部分，在所述绝缘层的一侧中的至少一个和形成在所述凹槽上的所述金属物质之间形成第一电路图案。 本发明通过设置与基板直接接触的散热器和印刷电路板的制造方法来提供具有高发热效率的印刷电路板。
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3.发明申请Conductive paste and method of manufacturing printed circuit board using the same 审中-公开导电浆料及使用其制造印刷电路板的方法公开(公告)号：US20110073252A1
公开(公告)日：2011-03-31
申请号：US12656019
申请日：2010-01-13
Applicant: Jun Oh Hwang , Jee Soo Mok , Eung Suek Lee
Inventor： Jun Oh Hwang , Jee Soo Mok , Eung Suek Lee
CPC classification number: H01B1/02 , H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4647 , H05K2201/0129 , H05K2201/0221 , H05K2201/0272 , H05K2201/0355 , H05K2203/0425
Abstract: The present invention provides a conductive paste including: a conductive powder particle including a polymer powder and a first low melting point metal and a second low melting point metal which are sequentially provided on a surface of the polymer powder and have different melting points; and a binder mixed in the conductive powder particle, and a method of manufacturing a printed circuit board using the same.
Abstract translation: 本发明提供一种导电性糊料，其特征在于，具备：具有聚合物粉末和第一低熔点金属和第二低熔点金属的导电性粉末粒子，其依次设置在所述聚合物粉末的表面上且具有不同的熔点; 和粘合剂混合在导电粉末颗粒中，以及制造使用其的印刷电路板的方法。
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公开(公告)号：US20090308650A1
公开(公告)日：2009-12-17
申请号：US12222176
申请日：2008-08-04
Applicant: Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
Inventor： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
CPC classification number: H05K3/4069 , B82Y10/00 , H05K3/1291 , H05K3/4647 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/09827 , H05K2203/1126 , Y10T29/49155
Abstract: The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved.
Abstract translation: 使用在含有碳纳米管的可燃性糊料在第一金属层上形成凸块的方法，在第一金属层上焙烧包括凸块的第一金属层，形成绝缘层和第二金属层，制造印刷电路板， 并且对第一和第二金属层进行图案化，由此降低了印刷电路板的电阻率，提高了导电性和冷却性能。
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5.发明授权公开(公告)号：US08377748B2
公开(公告)日：2013-02-19
申请号：US13137669
申请日：2011-09-01
Applicant: Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
Inventor： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
IPC: H01L23/467
CPC classification number: H01L23/373 , B82Y30/00 , C04B35/80 , C04B2235/3217 , C04B2235/3418 , C04B2235/407 , C04B2235/408 , C04B2235/5288 , F28F3/02 , F28F21/02 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , Y10T29/49002 , Y10T29/4935 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.
Abstract translation: 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基部和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。
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Patent Agency Ranking
公开(公告)号：US20120168205A1
公开(公告)日：2012-07-05
申请号：US13422909
申请日：2012-03-16
Applicant: Jun-Oh HWANG , Jee-Soo Mok , Jun-Heyoung Park , Kyung-Ah Lee , Eung-Suek Lee
Inventor： Jun-Oh HWANG , Jee-Soo Mok , Jun-Heyoung Park , Kyung-Ah Lee , Eung-Suek Lee
CPC classification number: B82Y10/00 , H05K1/0206 , H05K1/056 , H05K1/183 , H05K3/005 , H05K3/4069 , H05K3/4608 , H05K3/4647 , H05K3/4652 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/0394 , H05K2203/0108 , H05K2203/1131 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165
Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.
Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 该方法可以包括 提供绝缘层，其中第一金属层形成在绝缘层的一侧上; 在绝缘层上形成凹槽; 在所述槽的内侧和所述绝缘层的另一侧上形成金属物质; 以及通过去除所述第一金属层的一部分，在所述绝缘层的一侧中的至少一个和形成在所述槽上的所述金属物质之间形成第一电路图案。 本发明通过设置与基板直接接触的散热器和印刷电路板的制造方法来提供具有高发热效率的印刷电路板。
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7.发明申请公开(公告)号：US20110308069A1
公开(公告)日：2011-12-22
申请号：US13137669
申请日：2011-09-01
Applicant: Eung Suek LEE , Je Gwang YOO , Chang Sup RYU , Jun Oh HWANG , Jun Heyoung PARK , Jee Soo MOK
Inventor： Eung Suek LEE , Je Gwang YOO , Chang Sup RYU , Jun Oh HWANG , Jun Heyoung PARK , Jee Soo MOK
CPC classification number: H01L23/373 , B82Y30/00 , C04B35/80 , C04B2235/3217 , C04B2235/3418 , C04B2235/407 , C04B2235/408 , C04B2235/5288 , F28F3/02 , F28F21/02 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , Y10T29/49002 , Y10T29/4935 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.
Abstract translation: 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基底和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。
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8.发明申请CONDUCTIVE PASTE INCLUDING A CARBON NANOTUBE AND PRINTED CIRCUIT BOARD USING THE SAME 审中-公开包含碳纳米管和印刷电路板的导电胶公开(公告)号：US20090294739A1
公开(公告)日：2009-12-03
申请号：US12263685
申请日：2008-11-03
Applicant: Eung-Suek Lee , Je-Gwang Yoo , Chang-Sup Ryu , Jun-Oh Hwang , Tae-Eun Chang , Jee-Soo Mok
Inventor： Eung-Suek Lee , Je-Gwang Yoo , Chang-Sup Ryu , Jun-Oh Hwang , Tae-Eun Chang , Jee-Soo Mok
IPC: H01B1/02
CPC classification number: H01B1/24 , B82Y10/00 , H05K1/095 , H05K3/4069 , H05K2201/026 , H05K2201/0272 , H05K2201/0323 , H05K2203/0425
Abstract: The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics.
Abstract translation: 本发明提供一种包括碳纳米管的导电浆料和使用其的印刷电路板。 本发明提供了导电性优异的导电性糊剂，其导电性优异，可以实现X-Y互连，同时实现Z-互连，而不会使碳纳米管本身的原有特性丧失。
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公开(公告)号：US20100230146A1
公开(公告)日：2010-09-16
申请号：US12544959
申请日：2009-08-20
Applicant: Eung Suek LEE , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jee Soo Mok
Inventor： Eung Suek LEE , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jee Soo Mok
CPC classification number: H05K3/108 , B82Y10/00 , C23C18/38 , C25D5/022 , C25D5/10 , C25D9/08 , H05K3/249 , H05K2201/026 , H05K2201/0347 , H05K2203/135
Abstract: Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.
Abstract translation: 本发明公开了一种电路层，其包括在绝缘层上形成的化学镀铜层的CNT和沉积在化学镀铜层上的CNT层，因此电路层具有优异的电性能。
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公开(公告)号：US20090114425A1
公开(公告)日：2009-05-07
申请号：US12178285
申请日：2008-07-23
Applicant: Eung-Suek LEE , Seung-Hyun BAIK , Young-Jin KIM , Young-Seok OH , Jae-Boong CHOI , Dae-Woo SUH , Je-Gwang YOO , Chang-Sup RYU , Jun-Oh HWANG , Jee-Soo MOK
Inventor： Eung-Suek LEE , Seung-Hyun BAIK , Young-Jin KIM , Young-Seok OH , Jae-Boong CHOI , Dae-Woo SUH , Je-Gwang YOO , Chang-Sup RYU , Jun-Oh HWANG , Jee-Soo MOK
CPC classification number: H05K1/095 , B82Y10/00 , H01B1/24 , H05K3/4069 , H05K3/4614 , H05K2201/026 , H05K2203/1189
Abstract: A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can improve an electrical conductivity of the conductive paste.
Abstract translation: 公开了一种导电浆料和使用导电浆料的印刷电路板。 包含根据本发明的导电颗粒和碳纳米管的导电糊可以提高导电浆的导电性。
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