发明申请
- 专利标题: Semiconductor Device and Manufacturing Method Thereof
- 专利标题(中): 半导体器件及其制造方法
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申请号: US12721298申请日: 2010-03-10
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公开(公告)号: US20100230754A1公开(公告)日: 2010-09-16
- 发明人: Atsuo Isobe , Hiromichi Godo , Satoshi Shinohara
- 申请人: Atsuo Isobe , Hiromichi Godo , Satoshi Shinohara
- 申请人地址: JP Atsugi-shi
- 专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP2009-059157 20090312
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L21/762
摘要:
An object is to provide a semiconductor device which solves a problem that can occur when a substrate having an insulating surface is used. The semiconductor device includes a base substrate having an insulating surface; a conductive layer over the insulating surface; an insulating layer over the conductive layer; a semiconductor layer having a channel formation region, a first impurity region, a second impurity region, and a third impurity region provided between the channel formation region and the second impurity region over the insulating layer; a gate insulating layer configured to cover the semiconductor layer; a gate electrode over the gate insulating layer; a first electrode electrically connected to the first impurity region; and a second electrode electrically connected to the second impurity region. The conductive layer is held at a given potential.
公开/授权文献
- US08530333B2 Semiconductor device and manufacturing method thereof 公开/授权日:2013-09-10
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