发明申请
- 专利标题： Semiconductor module
- 专利标题（中）： 半导体模块
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申请号： US12656235申请日： 2010-01-21
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公开(公告)号： US20100232112A1公开(公告)日： 2010-09-16
- 发明人: Tatsuyuki Uechi , Hiromichi Agata , Kazuo Aoki , Tomoo Atarashi , Masahiro Tanae
- 申请人： Tatsuyuki Uechi , Hiromichi Agata , Kazuo Aoki , Tomoo Atarashi , Masahiro Tanae
- 申请人地址： JP Anjo-Shi
- 专利权人： AISIN AW CO., LTD.
- 当前专利权人： AISIN AW CO., LTD.
- 当前专利权人地址： JP Anjo-Shi
- 优先权： JP2009-059251 20090312
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H05K7/00
摘要：
A semiconductor module includes a base plate whose one surface is formed with a fin region in which a cooling fin is provided; a substrate that is disposed on the other surface of the base plate and provided with a switching device; and a case member having an internal space an opening formed in one wall of the case member so that the opening is smaller than the one surface of the base plate and larger than the fin region.
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