发明申请
- 专利标题: Through-Gate Implant for Body Dopant
- 专利标题(中): 穿孔植入物体内掺杂剂
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申请号: US12701972申请日: 2010-02-08
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公开(公告)号: US20100237417A1公开(公告)日: 2010-09-23
- 发明人: Geng Wang , Paul C. Parries
- 申请人: Geng Wang , Paul C. Parries
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L21/86
摘要:
The present invention, provides a semiconductor device including a substrate including a semiconductor layer overlying an insulating layer, wherein a back gate structure is present underlying the insulating layer and a front gate structure on the semiconductor layer; a channel dopant region underlying the front gate structure of the substrate, wherein the channel dopant region has a first concentration present at an interface of the semiconductor layer and the insulating layer and at least a second concentration present at the interface of the front gate structure and the semiconductor layer, wherein the first concentration is greater than the second concentration; and a source region and drain region present in the semiconductor layer of the substrate.
公开/授权文献
- US08273629B2 Through-gate implant for body dopant 公开/授权日:2012-09-25
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