发明申请
- 专利标题： METHOD AND APPARATUS FOR THERMAL TREATMENT OF SEMICONDUCTOR WORKPIECES
- 专利标题（中）： 半导体工件热处理方法和装置
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申请号： US12733436申请日： 2007-08-29
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公开(公告)号： US20100240226A1公开(公告)日： 2010-09-23
- 发明人: Yue Ma , Chuan He , Zhenxu Pang , Hui Wang , Voha Nuch
- 申请人： Yue Ma , Chuan He , Zhenxu Pang , Hui Wang , Voha Nuch
- 国际申请： PCT/CN2007/070582 WO 20070829
- 主分类号： H01L21/26
- IPC分类号： H01L21/26 ; F28C3/00
摘要：
The present invention provides an apparatus and method for rapid and uniform thermal treatment of semiconductor workpieces in two closely arranged thermal treatment chambers with a retractable door between them. The retractable door moves in between two thermal treatment chambers during heating or cooling process, and additional heating and cooling sources are provided for double-side thermal treatment of the semiconductor workpiece.
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