发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US12739302申请日： 2008-10-22
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公开(公告)号： US20100244231A1公开(公告)日： 2010-09-30
- 发明人: Shintaro Yamamichi , Kentaro Mori , Hideya Murai
- 申请人： Shintaro Yamamichi , Kentaro Mori , Hideya Murai
- 申请人地址： JP Tokyo
- 专利权人： NEC CORPORATION
- 当前专利权人： NEC CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2007-273929 20071022
- 国际申请： PCT/JP2008/069149 WO 20081022
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/48
摘要：
A semiconductor device comprises: a semiconductor element; a support substrate arranged on a surface of the semiconductor element opposite to a surface thereof provided with a pad, the support substrate being wider in area than the semiconductor element; a burying insulating layer on the support substrate for burying the semiconductor element therein; a fan-out interconnection led out from the pad to an area on the burying insulating layer lying more peripherally outwardly than the semiconductor element; and a reinforcement portion arranged in a preset area on top of outer periphery of the semiconductor element for augmenting the mechanical strength of the burying insulating layer and the fan-out interconnection.
公开/授权文献
- US08344498B2 Semiconductor device 公开/授权日：2013-01-01
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