发明申请
- 专利标题： SEMICONDUCTOR PACKAGE
- 专利标题（中）： 半导体封装
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申请号： US12751088申请日： 2010-03-31
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公开(公告)号： US20100244249A1公开(公告)日： 2010-09-30
- 发明人: Romain Coffy , Jean-François Sauty
- 申请人： Romain Coffy , Jean-François Sauty
- 申请人地址： FR Grenoble
- 专利权人： STMicroelectronics (Grenoble) SAS
- 当前专利权人： STMicroelectronics (Grenoble) SAS
- 当前专利权人地址： FR Grenoble
- 优先权： IBPCT/IB2009/053463 20090331
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60 ; H01L23/00
摘要：
A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a wire-bond of a first metallic composition, the wire-bond and the bond-pad being coated with a protection layer of a second metallic composition.
公开/授权文献
- US08786084B2 Semiconductor package and method of forming 公开/授权日：2014-07-22
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