发明申请
US20100244288A1 METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR CHIPS USING VARYING AREAS OF PRECISION
审中-公开
使用精度变化区域制作半导体器件的方法和装置
- 专利标题: METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR CHIPS USING VARYING AREAS OF PRECISION
- 专利标题(中): 使用精度变化区域制作半导体器件的方法和装置
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申请号: US12813808申请日: 2010-06-11
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公开(公告)号: US20100244288A1公开(公告)日: 2010-09-30
- 发明人: David C. Douglas , Ronald Ho , Robert J. Drost
- 申请人: David C. Douglas , Ronald Ho , Robert J. Drost
- 申请人地址: US CA Redwood City
- 专利权人: ORACLE INTERNATIONAL CORPORATION
- 当前专利权人: ORACLE INTERNATIONAL CORPORATION
- 当前专利权人地址: US CA Redwood City
- 主分类号: H01L23/544
- IPC分类号: H01L23/544 ; G03B27/52
摘要:
A system that fabricates a semiconductor chip. The system places patterns for components which require fine line-widths within a high resolution region of a reticle, wherein the high resolution region provides sharp focus for a given wavelength of light used by the lithography system. At the same time, the system places patterns for components which do not require fine line-widths outside of the high-resolution region of the reticle, thereby utilizing the region outside of the high-resolution region of the reticle instead of avoiding the region. Note that the coarseness for components placed outside of the high resolution region of the reticle is increased to compensate for the loss of optical focus outside of the high resolution region.
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