发明申请
- 专利标题: METHODS OF FORMING A HYPER-ABRUPT P-N JUNCTION AND DESIGN STRUCTURES FOR AN INTEGRATED CIRCUIT
- 专利标题(中): 形成用于集成电路的高压P-N结和设计结构的方法
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申请号: US12795108申请日: 2010-06-07
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公开(公告)号: US20100248432A1公开(公告)日: 2010-09-30
- 发明人: Jeffrey B. Johnson , Alvin J. Joseph , Robert M. Rassel , Yun Shi
- 申请人: Jeffrey B. Johnson , Alvin J. Joseph , Robert M. Rassel , Yun Shi
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINE CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINE CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L21/84
- IPC分类号: H01L21/84 ; G06F17/50
摘要:
Methods of forming hyper-abrupt p-n junctions and design structures for an integrated circuit containing devices structures with hyper-abrupt p-n junctions. The hyper-abrupt p-n junction is defined in a SOI substrate by implanting a portion of a device layer to have one conductivity type and then implanting a portion of this doped region to have an opposite conductivity type. The counterdoping defines the hyper-abrupt p-n junction. A gate structure carried on a top surface of the device layer operates as a hard mask during the ion implantations to assist in defining a lateral boundary for the hyper-abrupt p-n junction.
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