发明申请
- 专利标题： STEP-DOWN TRANSITION OF A SOLDER HEAD IN THE INJECTION MOLDING SOLDERING PROCESS
- 专利标题（中）： 注射成型焊接工艺中的焊头脱落过渡
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申请号： US12814746申请日： 2010-06-14
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公开(公告)号： US20100252225A1公开(公告)日： 2010-10-07
- 发明人: Mark D. Schultz
- 申请人： Mark D. Schultz
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： B22D17/00
- IPC分类号： B22D17/00
摘要：
A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the platform.
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