公开(公告)号：US07980445B2

公开(公告)日：2011-07-19

申请号：US12018421

申请日：2008-01-23

Applicant: Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

Inventor： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC: B23K1/00 ,  B23K37/06 ,  B23K37/00 ,  B23K35/12

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US07545648B2

公开(公告)日：2009-06-09

申请号：US12055263

申请日：2008-03-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20 ,  H01L23/34

CPC classification number: H01L23/433 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.

Abstract translation: 一种信息处理系统，包括：处理器; 记忆 输入/输出子系统; 以及耦合到处理器，存储器和输入/输出子系统的总线。 该系统还包括用于冷却处理器的冷却结构。 冷却结构包括：可压缩背衬; 设置在背衬和处理器之间的多个刚性铜元件; 设置在所述处理器上的第一适形导热层; 设置在可压缩背衬和刚性元件之间的第二适形导热层; 液体冷却剂; 以及用于容纳液体冷却剂的密封件。

公开(公告)号：US07505224B2

公开(公告)日：2009-03-17

申请号：US11374504

申请日：2006-03-13

Applicant: German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

Inventor： German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

IPC: G11B15/68 ,  G11B15/00

CPC classification number: G11B15/682 ,  G11B15/689 ,  G11B17/22 ,  G11B17/225 ,  G11B17/228

Abstract: In an automated library, data cartridges, such as magnetic tape cartridges, are stored in storage cells and accessed by data storage drives. An accessor with a gripper transports cartridges between storage cells and storage drives. Cartridges are prioritized according to their relative importance. A processor manages the placement of the cartridges in cells by having higher priority cartridges stored closer to the front of multi-cartridge cells than cartridges with a lower priority. Cartridges with a higher priority may also be stored closer to a storage drive than cartridges with a lower priority. A pusher may be used to push cartridges towards the front of multi-cartridge cells with an empty position to enable the gripper to reach the front cartridge.

Abstract translation: 在自动化库中，数据盒式磁带（如磁带盒）存储在存储单元中，并由数据存储驱动器访问。 具有夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 墨盒根据其相对重要性进行优先排序。 处理器通过将较高优先级的存储盒存储在比多盒单元的前面更靠近具有较低优先级的盒，来管理盒中的盒的放置。 具有较高优先级的墨盒也可以比具有较低优先级的墨盒更靠近存储驱动器。 可以使用推动器将空盒朝向多盒单元的前部推送，以使夹具能够到达前盒。

公开(公告)号：US07304849B2

公开(公告)日：2007-12-04

申请号：US10919180

申请日：2004-08-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H05K7/20

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling structure for an electronic device comprises a compliant cap preloaded over the electronic device. The compliant cap comprises a horizontal top surface and at least one vertical support for the surface, the vertical support comprising a compliant portion and wherein the compliant cap comprises a thermally conducting material.

Abstract translation: 电子设备的冷却结构包括预先装载在电子设备上的柔性盖。 顺应性盖包括水平顶表面和用于表面的至少一个垂直支撑件，垂直支撑件包括柔顺部分，并​​且其中柔性帽包括导热材料。

公开(公告)号：US09107327B2

公开(公告)日：2015-08-11

申请号：US13551929

申请日：2012-07-18

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: G05D23/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.

Abstract translation: 从数据中心去除热量的方法方面可以使用液体冷却剂冷却而不进行蒸气压缩制冷在液冷信息技术设备机架上。 该方法还可以包括通过使用基于数据中心的信息技术设备温度阈值的控制器装置通过一定范围的液体冷却剂流量来调节流向数据中心的液体冷却剂流。

公开(公告)号：US08760186B2

公开(公告)日：2014-06-24

申请号：US12708774

申请日：2010-02-19

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G01R31/01 ,  G01R1/067

CPC classification number: G01R1/06716 ,  G01R1/06744 ,  Y10T29/49224

Abstract: A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.

Abstract translation: 提供了一种探针装置，包括形成有通孔的探针层，电连接到测试设备的导体，设置在通孔侧壁上并与绝缘体侧壁绝缘;探针，设置在通孔内以与通孔隔开 导体，从而在施加外力的同时可移动，以及连接到探针的顺应性层，并且足够柔顺，以允许探针在施加外力时至少临时接触导体。

公开(公告)号：US08181846B2

公开(公告)日：2012-05-22

申请号：US13100133

申请日：2011-05-03

Applicant: Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

Inventor： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC: B23K31/02

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供了一种方法和装置，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US07757932B2

公开(公告)日：2010-07-20

申请号：US11508082

申请日：2006-08-22

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: B23K31/02 ,  B23K35/12 ,  B23K31/00

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L2224/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A method for dispensing solder bumps on a mold plate includes the steps of: relatively moving a fill head comprising an o-ring from a first location to a second location such that the o-ring decompresses as it crosses from the first location to the second location; filling at least one cavity in the mold plate with solder; and then relatively moving the fill head from the second location to a third location such that the o-ring decompresses as it crosses from the second location to the third location. The step of relatively moving the fill head from the first location to the second location includes moving from a higher elevation to a lower elevation. A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the interface.

Abstract translation: 一种用于在模具板上分配焊料凸块的方法包括以下步骤：将包括O形环的填充头从第一位置相对移动到第二位置，使得O形环在从第一位置穿过第二位置时减压 位置; 用焊料填充模具板中的至少一个空腔; 然后将填充头从第二位置相对移动到第三位置，使得O形环在从第二位置到第三位置越过时解压缩。 将填充头从第一位置相对移动到第二位置的步骤包括从较高的高度移动到较低的高度。 停车位置界面的模板包括：用于保持焊料的模板; 具有用于在模板上分配焊料凸块的O形环的填充头; 用于定位填充头的停车位置; 以及在模板和停车位置之间的平台，用于将填充头从第一位置相对移动到第二位置，使得O形环在通过界面时减压。

公开(公告)号：US20080170370A1

公开(公告)日：2008-07-17

申请号：US12055263

申请日：2008-03-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.

Abstract translation: 一种信息处理系统，包括：处理器; 记忆 输入/输出子系统; 以及耦合到处理器，存储器和输入/输出子系统的总线。 该系统还包括用于冷却处理器的冷却结构。 冷却结构包括：可压缩背衬; 设置在背衬和处理器之间的多个刚性铜元件; 设置在所述处理器上的第一适形导热层; 设置在可压缩背衬和刚性元件之间的第二适形导热层; 液体冷却剂; 以及用于容纳液体冷却剂的密封件。

公开(公告)号：US20080170033A1

公开(公告)日：2008-07-17

申请号：US11623216

申请日：2007-01-15

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G06F3/033

CPC classification number: G06F3/0321

Abstract: A method, system, and device are provided for displaying a graphical pointer at a location on a display area. The method includes displaying, with an information processing system, a display image at a display area. The pointing device captures an image corresponding to at least a portion of the display image at the display area in a field of view of the pointing device. A location within the display image corresponding to a location in the at least the portion of the display image in the field of view of the pointing device is determined. Optionally, a virtual pointer is caused to be displayed at the determined location within the display image.

Abstract translation: 提供了一种方法，系统和装置，用于在显示区域上的位置显示图形指针。 该方法包括用信息处理系统在显示区域显示显示图像。 指示设备在指示设备的视场中捕获与显示区域上的显示图像的至少一部分相对应的图像。 确定与指示设备的视场中的显示图像的至少部分中的位置对应的显示图像内的位置。 可选地，使虚拟指针显示在显示图像内的确定位置处。