发明申请
- 专利标题： ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE
- 专利标题（中）： 电子设备和包装电子设备的方法
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申请号： US12419708申请日： 2009-04-07
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公开(公告)号： US20100252919A1公开(公告)日： 2010-10-07
- 发明人: Jianwen Xu , Lizabeth Ann Keser , Goerge R. Leal , Betty H. Yeung
- 申请人： Jianwen Xu , Lizabeth Ann Keser , Goerge R. Leal , Betty H. Yeung
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/50
摘要：
An electronic device can include a package device structure including a die encapsulated within a packaging material. The package device structure can have a first side and a second side opposite the first side. The electronic device can include a first layer along the first side of the package device structure. The first layer can be capable of causing a first deformation of the package device structure. The electronic device can also include a second layer along the second side of the package device structure. The second layer can be capable of causing a second deformation of the package device structure, the second deformation opposite the first deformation.