发明申请
- 专利标题: METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING
- 专利标题(中): 改进的脆性材料加工方法
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申请号: US12732020申请日: 2010-03-25
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公开(公告)号: US20100252959A1公开(公告)日: 2010-10-07
- 发明人: Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffrey Howerton
- 申请人: Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffrey Howerton
- 申请人地址: US OR Portland
- 专利权人: Electro Scientific Industries, Inc.
- 当前专利权人: Electro Scientific Industries, Inc.
- 当前专利权人地址: US OR Portland
- 主分类号: B44C1/22
- IPC分类号: B44C1/22 ; B29C35/08
摘要:
An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location.
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