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    METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE
    2.
    发明申请
    METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE 有权
    用于激光加工玻璃与渐变边缘的方法

    公开(公告)号：US20100147813A1

    公开(公告)日：2010-06-17

    申请号：US12336609

    申请日：2008-12-17

    申请人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffery Howerton

    发明人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffery Howerton

    IPC分类号： B23K26/38

    CPC分类号： B23K26/40 ,  B23K2103/50 ,  B28D1/22 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/082

    摘要： A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

    摘要翻译： 描述了激光加工玻璃或玻璃状材料的激光加工工艺。 在一个制造操作中，该过程在具有倒角边缘的物品中加工制品或特征。 倒角边缘在玻璃和玻璃状材料中是理想的，因为它们抵抗压裂或碎裂并消除锋利的边缘。 在一个制造操作中在制品中制造物品或特征是期望的，因为通过在激光加工之后不需要将物品转移到单独的机器进行倒角，因此可以节省时间和费用。 或者，它可以允许使用较便宜的设备，因为用于加工的相同的激光可用于形成倒角，而不是具有单独的工艺来执行倒角。 使用激光加工生产倒角可以获得高品质的倒角，无需单独的抛光或精加工。

    Method of and apparatus for laser drilling holes with improved taper
    4.
    发明授权
    Method of and apparatus for laser drilling holes with improved taper 失效
    具有改进锥度的激光钻孔的方法和设备

    公开(公告)号：US08710402B2

    公开(公告)日：2014-04-29

    申请号：US11757253

    申请日：2007-06-01

    申请人： Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

    发明人： Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

    IPC分类号： B23K26/00 ,  B23K26/08

    CPC分类号： B23K26/384 ,  B23K26/389 ,  B23K2101/36 ,  H05K3/0035 ,  H05K2201/09827

    摘要： A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

    摘要翻译： 用于在多层电子电路中钻出具有可选锥度的盲孔的方法和装置允许在层之间形成电连接，同时保持质量和生产量。 该方法依赖于识别定义锥度的通孔的顶部直径和通孔的底部直径是两个单独的方程组的函数。 这些方程的同时解决方案产生一个解空间，可以优化吞吐量，同时使用具有相同脉冲参数的临时未修改的Q开关CO2激光脉冲保持选定的锥度和质量。 不需要实时脉冲裁剪; 因此，系统复杂性和成本可能会降低。

    Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
    6.
    发明申请
    Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories 有权
    通过以圆形和螺旋形轨迹移动精确定时的激光脉冲来处理孔的方法

    公开(公告)号：US20060027544A1

    公开(公告)日：2006-02-09

    申请号：US10912525

    申请日：2004-08-04

    申请人： Robert Pailthorp ,  Weisheng Lei ,  Hisashi Matsumoto ,  Glenn Simenson ,  David Watt ,  Mark Unrath ,  William Jordens

    发明人： Robert Pailthorp ,  Weisheng Lei ,  Hisashi Matsumoto ,  Glenn Simenson ,  David Watt ,  Mark Unrath ,  William Jordens

    IPC分类号： B23K26/38

    CPC分类号： H05K3/0026 ,  B23K26/389 ,  H05K2201/09063

    摘要： High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.

    摘要翻译： 从样品高速去除材料采用光束定位器，用于沿着各种圆形和螺旋形激光工具图案引导激光束轴线。 优选的材料去除方法需要引起梁的轴线和样品之间的相对运动，将束轴线以入口段加速度并沿着入口轨迹引导到在激光束脉冲发射开始的样本内的入口位置， 沿着试样中的圆周边加速度移动光束轴，以沿着试样的圆形段移除材料，并将进入段加速度设置为小于圆周边加速度的两倍。

    Methods of drilling through-holes in homogenous and non-homogeneous substrates
    7.
    发明申请
    Methods of drilling through-holes in homogenous and non-homogeneous substrates 失效
    在同质和非均匀基质中钻孔的方法

    公开(公告)号：US20050230365A1

    公开(公告)日：2005-10-20

    申请号：US10825039

    申请日：2004-04-14

    申请人： Weisheng Lei ,  John Davignon

    发明人： Weisheng Lei ,  John Davignon

    IPC分类号： B23K26/38 ,  B23K26/40 ,  H01L21/768 ,  H01L23/48 ,  H05K3/00

    CPC分类号： H05K3/0038 ,  B23K26/384 ,  B23K26/40 ,  B23K2103/36 ,  B23K2103/50 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0026 ,  H05K2203/108 ,  H05K2203/1476 ,  H01L2924/00012 ,  H01L2924/00

    摘要： A differential diameter hole drilling method by which through-holes having improved major surface quality are formed in a target material involves drilling a pilot hole having a diameter that is less than the desired diameter of the through-hole and then drilling a through-hole having the desired diameter. The pilot hole forms a channel from which thermal energy produced during laser drilling can diffuse into the environment, thereby reducing the amount of thermal energy diffusing into the surrounding target material matrix and the degree of thermal damage to the heat affected zone of the target material matrix. The pilot hole also forms a channel through which ablated target material may be removed, thereby increasing overall through-hole throughput. Pilot hole formation reduces the thermal energy required to form the remaining portion of the through-hole and thereby results in less thermal damage to the surrounding target material matrix.

    摘要翻译： 在目标材料中形成具有改善的主表面质量的通孔的差分直径钻孔方法包括钻出具有小于通孔所需直径的直径的导向孔，然后钻一个具有 所需的直径。 引导孔形成通道，激光钻孔期间产生的热能可以扩散到环境中，从而减少扩散到周围目标材料基体中的热能的量和对目标材料基体的热影响区的热损伤程度 。 引导孔还形成通道，通过该通道可以去除烧蚀的靶材料，从而增加整体通孔生产量。 先导孔形成减少了形成通孔的剩余部分所需的热能，从而导致对周围目标材料基体的较少的热损伤。

    METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING
    8.
    发明申请
    METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING 审中-公开
    改进的脆性材料加工方法

    公开(公告)号：US20100252959A1

    公开(公告)日：2010-10-07

    申请号：US12732020

    申请日：2010-03-25

    申请人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffrey Howerton

    发明人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffrey Howerton

    IPC分类号： B44C1/22 ,  B29C35/08

    CPC分类号： B23K26/40 ,  B23K2103/50

    摘要： An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location.

    摘要翻译： 提出了一种用于脆性材料如玻璃中的激光加工特征的改进方法，其中分析与特征相关的刀具路径，以确定使用不相邻的激光脉冲激光加工特征所需的通过数量。 在后续通过期间施加的激光脉冲被定位成与先前的激光光斑位置重叠预定的重叠量。 以这种方式，没有单个点接收由紧邻的先前脉冲位置施加的紧随其后的激光脉冲引起的过多的激光辐射。

    METHOD OF AND APPARATUS FOR LASER DRILLING HOLES WITH IMPROVED TAPER
    10.
    发明申请
    METHOD OF AND APPARATUS FOR LASER DRILLING HOLES WITH IMPROVED TAPER 失效
    激光钻孔的方法和装置改进的TAPER

    公开(公告)号：US20080296273A1

    公开(公告)日：2008-12-04

    申请号：US11757253

    申请日：2007-06-01

    申请人： Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

    发明人： Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

    IPC分类号： B23K26/38

    CPC分类号： B23K26/384 ,  B23K26/389 ,  B23K2101/36 ,  H05K3/0035 ,  H05K2201/09827

    摘要： A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

    摘要翻译： 用于在多层电子电路中钻出具有可选锥度的盲孔的方法和装置允许在层之间形成电连接，同时保持质量和生产量。 该方法依赖于识别定义锥度的通孔的顶部直径和通孔的底部直径是两个单独的方程组的函数。 这些方程的同时解决方案产生一个解空间，可以优化吞吐量，同时使用具有相同脉冲参数的临时未修改的Q开关CO2激光脉冲保持选定的锥度和质量。 不需要实时脉冲裁剪; 因此，系统复杂性和成本可能会降低。