发明申请
US20100265685A1 WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PROCESS USING THE SAME
审中-公开
使用相同的接线连接材料和接线连接板生产工艺
- 专利标题： WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PROCESS USING THE SAME
- 专利标题（中）： 使用相同的接线连接材料和接线连接板生产工艺
-
申请号： US12824709申请日： 2010-06-28
-
公开(公告)号： US20100265685A1公开(公告)日： 2010-10-21
- 发明人: Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
- 申请人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
- 优先权： JPHEILL-238409 19990825; JP2000-92978 20000328
- 主分类号： H05K1/14
- IPC分类号： H05K1/14 ; H05K3/00
摘要：
The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
信息查询
