发明申请
- 专利标题： MICROELECTRONIC PACKAGES FABRICATED AT THE WAFER LEVEL AND METHODS THEREFOR
- 专利标题（中）： 微电子封装在水平面上制作及其方法
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申请号： US12829709申请日： 2010-07-02
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公开(公告)号： US20100270679A1公开(公告)日： 2010-10-28
- 发明人: Belgacem Haba , Giles Humpston
- 申请人： Belgacem Haba , Giles Humpston
- 申请人地址： US CA San Jose
- 专利权人： TESSERA, INC.
- 当前专利权人： TESSERA, INC.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60
摘要：
A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.
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