发明申请
US20100272887A1 THIN FILM FORMING APPARATUS AND THIN FILM FORMING METHOD 审中-公开
薄膜成型装置和薄膜成型方法

THIN FILM FORMING APPARATUS AND THIN FILM FORMING METHOD
摘要:
To provide a thin film forming apparatus capable of uniformly and adequately cooling down a substrate. The thin film forming apparatus of the present invention forms a thin film on an elongated substrate in vacuum and includes: a cooling body 1 provided close to a rear surface of the substrate being transferred at an opening 31; a gas introducing unit configured to introduce a gas to between the cooling body 1 and the substrate 21; and a substrate holding unit 3 configured to hold vicinities of both width-direction ends of the substrate traveling at the opening 31.
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