发明申请
- 专利标题: Method of Making Integrated Circuit Chip Utilizing Oriented Carbon Nanotube Conductive Layers
- 专利标题(中): 制造集成电路芯片利用定向碳纳米管导电层的方法
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申请号: US12830510申请日: 2010-07-06
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公开(公告)号: US20100273298A1公开(公告)日: 2010-10-28
- 发明人: Toshiharu Furukawa , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Peter H. Mitchell
- 申请人: Toshiharu Furukawa , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Peter H. Mitchell
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L21/98
- IPC分类号: H01L21/98
摘要:
A conductive layer in an integrated circuit is formed as a sandwich having multiple sublayers, including at least one sublayer of oriented carbon nanotubes. The conductive layer sandwich preferably contains two sublayers of carbon nanotubes, in which the carbon nanotube orientation in one sublayer is substantially perpendicular to that of the other layer. The conductive layer sandwich preferably contains one or more additional sublayers of a conductive material, such as a metal. In one embodiment, oriented carbon nanotubes are created by forming a series of elongated parallel catalyst strips on a horizontal surface, and growing carbon nanotubes from the catalyst in the presence of a directional flow of reactant gases.
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