发明申请
- 专利标题: Bump Pad Structure
- 专利标题(中): 凸块结构
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申请号: US12726449申请日: 2010-03-18
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公开(公告)号: US20100283148A1公开(公告)日: 2010-11-11
- 发明人: Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
- 申请人: Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L23/485
- IPC分类号: H01L23/485 ; H01L21/60
摘要:
An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
公开/授权文献
- US08405211B2 Bump pad structure 公开/授权日:2013-03-26