发明申请
- 专利标题： Die Down Ball Grid Array Packages and Method for Making Same
- 专利标题（中）： 降压球栅阵列封装及其制作方法
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申请号： US12842627申请日： 2010-07-23
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公开(公告)号： US20100285637A1公开(公告)日： 2010-11-11
- 发明人: Reza-Ur Rahman Khan , Sam Ziqun Zhao
- 申请人： Reza-Ur Rahman Khan , Sam Ziqun Zhao
- 申请人地址： US CA Irvine
- 专利权人： Broadcom Corporation
- 当前专利权人： Broadcom Corporation
- 当前专利权人地址： US CA Irvine
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L21/58
摘要：
A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.
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