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公开(公告)号：US08021927B2
公开(公告)日：2011-09-20
申请号：US12842627
申请日：2010-07-23
IPC分类号： H01L21/58
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/36 , H01L23/3677 , H01L23/49816 , H01L23/49833 , H01L23/50 , H01L23/552 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/16227 , H01L2224/16235 , H01L2224/16245 , H01L2224/2919 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/16225 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.
摘要翻译： 提供了一种形成球栅阵列（BGA）封装的方法。 该方法包括将集成电路（IC）管芯耦合到衬底的开口中的散热器，衬底的开口延伸穿过衬底，使得散热器的一部分可通过开口接近并且将第一表面 的第二衬底通过凸块互连件连接到IC管芯。 第二衬底的第二表面具有能够耦合到板的接触焊盘的阵列。
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公开(公告)号：US20100285637A1
公开(公告)日：2010-11-11
申请号：US12842627
申请日：2010-07-23
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/36 , H01L23/3677 , H01L23/49816 , H01L23/49833 , H01L23/50 , H01L23/552 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/16227 , H01L2224/16235 , H01L2224/16245 , H01L2224/2919 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/16225 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.
摘要翻译： 提供了一种形成球栅阵列（BGA）封装的方法。 该方法包括将集成电路（IC）管芯耦合到衬底的开口中的散热器，衬底的开口延伸穿过衬底，使得散热器的一部分可通过开口接近并且将第一表面 的第二衬底通过凸块互连件连接到IC管芯。 第二衬底的第二表面具有能够耦合到板的接触焊盘的阵列。
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