发明申请
- 专利标题： PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
- 专利标题（中）： 印刷线路板及其制造方法
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申请号： US12777296申请日： 2010-05-11
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公开(公告)号： US20100288539A1公开(公告)日： 2010-11-18
- 发明人: Mineo WASHIMA
- 申请人： Mineo WASHIMA
- 申请人地址： JP Tokyo
- 专利权人： HITACHI CABLE LTD.
- 当前专利权人： HITACHI CABLE LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-115442 20090512
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/02
摘要：
A printed wiring board is provided, having conductor patterns formed on a surface of an insulating substrate, wherein the conductor pattern is formed by lamination of a base metal pattern formed by patterning a base metal film which is formed on a surface of the insulating substrate, and plating a metal pattern formed on the base metal pattern by selective plating after the base metal pattern is formed.
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