发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REINFORCED ENCAPSULANT HAVING EMBEDDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有嵌入式互连的加强型封装的集成电路封装系统及其制造方法
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申请号： US12777415申请日： 2010-05-11
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公开(公告)号： US20100289134A1公开(公告)日： 2010-11-18
- 发明人: Seng Guan Chow , Il Kwon Shim , Heap Hoe Kuan , Youngcheol Kim
- 申请人： Seng Guan Chow , Il Kwon Shim , Heap Hoe Kuan , Youngcheol Kim
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/56 ; H01L23/488
摘要：
A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling stacking interconnects on the component side; and forming an integrated circuit receptacle, for receiving an integrated circuit device, by molding a reinforced encapsulant on the component side and exposing a portion of the stacking interconnects.
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