A condenser microphone includes a conductive layer which is partially disposed on an insulation ring of a second base to reduce stray capacitance. The condenser microphone includes: a conductive case with an opened surface, wherein an end portion of the case is bent to attach to a printed circuit board (PCB); a diaphragm mounted inside the case a backplate facing the diaphragm with a predetermined distance set by a spacer; a first base made of an insulating ring to electrically insulate the backplate from the case; a second base electrically connected to the backplate by disposing a conductive layer on a portion of a ring formed of an insulating material. The PCB has a circuit component and a conductive pattern for connecting the second base, and on another surface has a conductive pattern for connecting the bent end portion of the case and a connection terminal to an external circuit.