Invention Application
- Patent Title: POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND
- Patent Title (中): 正极性组合物，形成耐火模式的方法和聚合物
-
Application No.: US12781540Application Date: 2010-05-17
-
Publication No.: US20100297560A1Publication Date: 2010-11-25
- Inventor: Takehiro SESHIMO , Yoshiyuki UTSUMI , Yoshitaka KOMURO , Takeyoshi MIMURA , Daichi TAKAKI
- Applicant: Takehiro SESHIMO , Yoshiyuki UTSUMI , Yoshitaka KOMURO , Takeyoshi MIMURA , Daichi TAKAKI
- Applicant Address: JP Kawasaki-shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2009-122566 20090520
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/20 ; C08F216/12
Abstract:
A positive resist composition including a base component (A′) which exhibits increased solubility in an alkali developing solution under action of acid and generates acid upon exposure, the base component (A′) including a polymeric compound (A1′) having a structural unit (a5-1) represented by general formula (a5-1), a structural unit (a0-1) represented by general formula (a0-1) and a structural unit (a0-2) that generates acid upon exposure, the structural unit (a0-2) containing a group represented by general formula (a0-2′) (wherein represents an anion moiety represented by one of general formulas (1) to (5)).
Public/Granted literature
- US08298748B2 Positive resist composition, method of forming resist pattern, and polymeric compound Public/Granted day:2012-10-30
Information query
IPC分类:
