发明申请
US20100308350A1 LED Chip-Based Lighting Products And Methods Of Building 有权
LED芯片照明产品和建筑方法

  • 专利标题: LED Chip-Based Lighting Products And Methods Of Building
  • 专利标题(中): LED芯片照明产品和建筑方法
  • 申请号: US12857472
    申请日: 2010-08-16
  • 公开(公告)号: US20100308350A1
    公开(公告)日: 2010-12-09
  • 发明人: Jeffrey Bisberg
  • 申请人: Jeffrey Bisberg
  • 主分类号: H01L33/58
  • IPC分类号: H01L33/58 H01L33/00
LED Chip-Based Lighting Products And Methods Of Building
摘要:
Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.
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