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公开(公告)号：US08425085B2
公开(公告)日：2013-04-23
申请号：US12431674
申请日：2009-04-28
申请人： Peter Van Laanen , Jeffrey Bisberg , Neil Cannon , Tracy Earles
发明人： Peter Van Laanen , Jeffrey Bisberg , Neil Cannon , Tracy Earles
IPC分类号： F21V29/00
CPC分类号： F21V21/00 , F21V3/02 , F21V3/04 , F21V29/004 , F21V29/506 , F21V29/507 , F21V29/70 , F21V29/83 , F21Y2115/10 , H05K1/0203 , H05K1/181 , H05K3/0061 , H05K2201/0969 , H05K2201/10106 , H05K2203/1572 , Y02B20/386
摘要： An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture.
摘要翻译： 基于LED的照明系统包括形成一个或多个孔的壳体，其前侧具有导体的PCB以及安装有导体的一个或多个LED。 PCB安装有导体靠近壳体的顶表面，使得LED通过孔发射光，并且由一个或多个LED产生的热量主要通过导体散发到壳体。 一种用于灯具的改装设备包括其前侧具有导体的PCB和安装有导体的一个或多个LED。 PCB安装有导体靠近安装支架的表面，其被配置为安装到灯具，使得当支架安装到灯具上时，由一个或多个LED产生的热量主要通过导体和 结构元件到灯具。
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公开(公告)号：US20120042512A1
公开(公告)日：2012-02-23
申请号：US13287796
申请日：2011-11-02
申请人： Jeffrey Bisberg
发明人： Jeffrey Bisberg
IPC分类号： H05K3/30
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H05K1/056 , Y10T29/4913 , H01L2924/00
摘要： A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.
摘要翻译： 构建基于发光二极管（LED）的照明产品的方法包括将多个未封装的LED芯片或LED直接安装在双面板的表面上的导体上，将面板与支撑结构集成以形成照明产品 所述面板的至少一个表面形成所述照明产品的外表面，并且耦合漫射器，所述扩散器与所述LED芯片或LED的表面距离相邻LED芯片或LED之间的平均间隔的至少两倍 。 构建基于LED芯片的照明产品的方法包括将未封装的LED芯片直接安装在形成在双面板的表面上的导体上，并将盖板安装到LED芯片上，使得从LED芯片发射的光通过 盖板。
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公开(公告)号：USD632418S1
公开(公告)日：2011-02-08
申请号：US29325189
申请日：2008-09-26
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公开(公告)号：US20110121324A2
公开(公告)日：2011-05-26
申请号：US12857472
申请日：2010-08-16
申请人： Jeffrey Bisberg
发明人： Jeffrey Bisberg
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H05K1/056 , Y10T29/4913 , H01L2924/00
摘要： Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.
摘要翻译： 基于发光二极管（LED）芯片的照明产品和制造方法包括在面板的内表面上形成导体，将多个未封装的LED芯片直接安装在导体上，以及将面板与支撑结构集成以形成照明 产品，使得面板的外表面形成照明产品的外表面。 基于发光二极管（LED）的照明产品包括具有内表面和外表面的面板，所述外表面形成照明产品的外表面，在内表面上图案化的导体，以及直接安装到 导体。
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公开(公告)号：US20100308350A1
公开(公告)日：2010-12-09
申请号：US12857472
申请日：2010-08-16
申请人： Jeffrey Bisberg
发明人： Jeffrey Bisberg
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H05K1/056 , Y10T29/4913 , H01L2924/00
摘要： Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.
摘要翻译： 基于发光二极管（LED）芯片的照明产品和制造方法包括在面板的内表面上形成导体，将多个未封装的LED芯片直接安装在导体上，以及将面板与支撑结构集成以形成照明 产品，使得面板的外表面形成照明产品的外表面。 基于发光二极管（LED）的照明产品包括具有内表面和外表面的面板，所述外表面形成照明产品的外表面，在内表面上图案化的导体，以及直接安装到 导体。
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公开(公告)号：US20090290348A1
公开(公告)日：2009-11-26
申请号：US12431674
申请日：2009-04-28
申请人： Peter VAN LAANEN , Jeffrey BISBERG , Neil CANNON , Tracy EARLES
发明人： Peter VAN LAANEN , Jeffrey BISBERG , Neil CANNON , Tracy EARLES
CPC分类号： F21V21/00 , F21V3/02 , F21V3/04 , F21V29/004 , F21V29/506 , F21V29/507 , F21V29/70 , F21V29/83 , F21Y2115/10 , H05K1/0203 , H05K1/181 , H05K3/0061 , H05K2201/0969 , H05K2201/10106 , H05K2203/1572 , Y02B20/386
摘要： An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture.
摘要翻译： 基于LED的照明系统包括形成一个或多个孔的壳体，其前侧具有导体的PCB以及安装有导体的一个或多个LED。 PCB安装有导体靠近壳体的顶表面，使得LED通过孔发射光，并且由一个或多个LED产生的热量主要通过导体散发到壳体。 一种用于灯具的改装设备包括其前侧具有导体的PCB和安装有导体的一个或多个LED。 PCB安装有导体靠近安装支架的表面，其被配置为安装到灯具，使得当支架安装到灯具上时，由一个或多个LED产生的热量主要通过导体和 结构元件到灯具。
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公开(公告)号：USD699886S1
公开(公告)日：2014-02-18
申请号：US29391284
申请日：2011-05-05
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公开(公告)号：US08058659B2
公开(公告)日：2011-11-15
申请号：US12857472
申请日：2010-08-16
申请人： Jeffrey Bisberg
发明人： Jeffrey Bisberg
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H05K1/056 , Y10T29/4913 , H01L2924/00
摘要： Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.
摘要翻译： 基于发光二极管（LED）芯片的照明产品和制造方法包括在面板的内表面上形成导体，将多个未封装的LED芯片直接安装在导体上，以及将面板与支撑结构集成以形成照明 产品，使得面板的外表面形成照明产品的外表面。 基于发光二极管（LED）的照明产品包括具有内表面和外表面的面板，所述外表面形成照明产品的外表面，在内表面上图案化的导体，以及直接安装到 导体。
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公开(公告)号：US20100285620A1
公开(公告)日：2010-11-11
申请号：US12843194
申请日：2010-07-26
申请人： Jeffrey Bisberg
发明人： Jeffrey Bisberg
IPC分类号： H01L21/50
CPC分类号： H01L33/62 , H01L24/32 , H01L33/54 , H01L33/58 , H01L2924/12041 , H05K1/0269 , H05K1/141 , H05K1/145 , H05K3/284 , H05K3/321 , H05K2201/0108 , H05K2201/09918 , H05K2201/10106 , H05K2201/2036 , H05K2201/2054 , H05K2203/166 , H01L2924/00
摘要： A method of packaging a light-emitting diode (LED) chip includes coupling the LED chip to a printed circuit board (PCB) and forming a conductor on a cover plate. Conductive epoxy is applied to at least one of the LED chip and the conductor. The cover plate is coupled to the PCB such that the conductive epoxy forms a circuit connection between the LED chip and the conductor. An LED-based lighting product includes a PCB with one or more LED chips mounted directly thereon. A cover plate has conductors that couple at least to the one or more LED chips and to the PCB, such that the conductors form electrical connections between the one or more LED chips and the PCB.
摘要翻译： 封装发光二极管（LED）芯片的方法包括将LED芯片耦合到印刷电路板（PCB）并在盖板上形成导体。 导电环氧树脂被施加到LED芯片和导体中的至少一个。 盖板耦合到PCB，使得导电环氧树脂在LED芯片和导体之间形成电路连接。 基于LED的照明产品包括具有直接安装在其上的一个或多个LED芯片的PCB。 盖板具有至少耦合到一个或多个LED芯片和PCB的导体，使得导体在一个或多个LED芯片和PCB之间形成电连接。
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公开(公告)号：US07791089B2
公开(公告)日：2010-09-07
申请号：US12198662
申请日：2008-08-26
申请人： Jeffrey Bisberg
发明人： Jeffrey Bisberg
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/32 , H01L33/54 , H01L33/58 , H01L2924/12041 , H05K1/0269 , H05K1/141 , H05K1/145 , H05K3/284 , H05K3/321 , H05K2201/0108 , H05K2201/09918 , H05K2201/10106 , H05K2201/2036 , H05K2201/2054 , H05K2203/166 , H01L2924/00
摘要： A method of packaging a light-emitting diode (LED) chip includes coupling the LED chip to a printed circuit board (PCB) and forming a conductor on a cover plate. Conductive epoxy is applied to at least one of the LED chip and the conductor. The cover plate is coupled to the PCB such that the conductive epoxy forms a circuit connection between the LED chip and the conductor. An LED-based lighting product includes a PCB with one or more LED chips mounted directly thereon. A cover plate has conductors that couple at least to the one or more LED chips and to the PCB, such that the conductors form electrical connections between the one or more LED chips and the PCB.
摘要翻译： 封装发光二极管（LED）芯片的方法包括将LED芯片耦合到印刷电路板（PCB）并在盖板上形成导体。 导电环氧树脂被施加到LED芯片和导体中的至少一个。 盖板耦合到PCB，使得导电环氧树脂在LED芯片和导体之间形成电路连接。 基于LED的照明产品包括具有直接安装在其上的一个或多个LED芯片的PCB。 盖板具有至少耦合到一个或多个LED芯片和PCB的导体，使得导体在一个或多个LED芯片和PCB之间形成电连接。
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