发明申请
- 专利标题： METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 制造半导体器件的方法
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申请号： US12734695申请日： 2008-10-30
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公开(公告)号： US20100308476A1公开(公告)日： 2010-12-09
- 发明人: Yasuhiro Suga , Kazunori Hamazaki
- 申请人： Yasuhiro Suga , Kazunori Hamazaki
- 申请人地址： JP Tokyo
- 专利权人： SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- 当前专利权人： SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-097795 20080404
- 国际申请： PCT/JP2008/069713 WO 20081030
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; H01L21/56
摘要：
A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.
公开/授权文献
- US08409932B2 Method for manufacturing semiconductor device 公开/授权日：2013-04-02
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