公开(公告)号：US20100308476A1

公开(公告)日：2010-12-09

申请号：US12734695

申请日：2008-10-30

申请人： Yasuhiro Suga ,  Kazunori Hamazaki

发明人： Yasuhiro Suga ,  Kazunori Hamazaki

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.

摘要翻译： 半导体芯片通过其间具有热固性粘合剂膜而临时固定在电路板上。 密封树脂膜设置有脱模膜和热固性密封树脂层，其被层压在脱模膜上并且具有半导体芯片的厚度的0.5至2倍的膜厚度。 密封树脂膜布置在半导体芯片上，使得热固性密封树脂层面向半导体芯片。 通过使用橡胶硬度为5-100的橡胶头，将电路板一侧的热量施加到从脱模膜一侧向密封树脂膜施加压力，以将半导体芯片接合在电路板上。 在用树脂密封半导体芯片之后，剥离脱模膜。

公开(公告)号：US20090230171A1

公开(公告)日：2009-09-17

申请号：US12466977

申请日：2009-05-15

申请人： Takashi Matsumura ,  Hisashi Ando ,  Shiyuki Kanisawa ,  Yasuhiro Suga ,  Noriaki Kudo

发明人： Takashi Matsumura ,  Hisashi Ando ,  Shiyuki Kanisawa ,  Yasuhiro Suga ,  Noriaki Kudo

IPC分类号： B23K37/00

CPC分类号： B30B5/02 ,  B30B15/065 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

摘要翻译： 提供了一种安装方法和安装装置，其可以通过使用粘合剂来安装具有高可靠性的电气部件。 安装方法包括通过使用各向异性导电粘合剂膜将IC芯片热压接合到布线板上。 在热压接期间，IC芯片的顶部区域以预定的压力压在布线板上，并且IC芯片的侧面区域以比被施加到IC芯片的顶部区域的压力更小的压力被按压。 橡胶硬度为40以上且80以下的弹性体用于热压接头的压接部。 各向异性导电粘合膜含有熔融粘度为1.0×10 2 mPa·s以上且1.0×10 5 mPa·s以下的粘结树脂。

公开(公告)号：US06332786B1

公开(公告)日：2001-12-25

申请号：US09480259

申请日：2000-01-11

申请人： Yasuhiro Suga ,  Noriyuki Honda

发明人： Yasuhiro Suga ,  Noriyuki Honda

IPC分类号： H01R458

CPC分类号： H01L24/31 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29017 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2924/00014 ,  H01L2924/00

摘要： An anisotropic electrically conductive film which reduces a connection resistance value in electrical connection to assure reliable electric connection, and an electrical connecting device employing this anisotropic electrically conductive film. To this end, metal coated particles having a resin (40) as a core material are dispersed in an insulating adhesive (8) to give an anisotropic electrically eonductive film. The resin (40) of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 Å.

摘要翻译： 各向异性导电膜，其降低电连接中的连接电阻值以确保可靠的电连接;以及使用该各向异性导电膜的电连接装置。 为此，将具有树脂（40）作为芯材的金属涂覆的颗粒分散在绝缘粘合剂（8）中，得到各向异性的电导膜。 金属涂覆颗粒的树脂（40）涂覆有厚度为1000至3000的金属层。

公开(公告)号：US08409932B2

公开(公告)日：2013-04-02

申请号：US12734695

申请日：2008-10-30

申请人： Yasuhiro Suga ,  Kazunori Hamazaki

发明人： Yasuhiro Suga ,  Kazunori Hamazaki

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.

摘要翻译： 半导体芯片通过其间具有热固性粘合剂膜而临时固定在电路板上。 密封树脂膜设置有脱模膜和热固性密封树脂层，其被层压在脱模膜上并且具有半导体芯片的厚度的0.5至2倍的膜厚度。 密封树脂膜布置在半导体芯片上，使得热固性密封树脂层面向半导体芯片。 通过使用橡胶硬度为5-100的橡胶头，将电路板一侧的热量施加到从脱模膜一侧向密封树脂膜施加压力，以将半导体芯片接合在电路板上。 在用树脂密封半导体芯片之后，剥离脱模膜。

公开(公告)号：US20110237028A1

公开(公告)日：2011-09-29

申请号：US13131427

申请日：2010-02-23

申请人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

发明人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

IPC分类号： H01L21/50

CPC分类号： H01L24/92 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16238 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32012 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/364 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

摘要翻译： 提供一种制造半导体器件的方法。 该方法包括通过使用绝缘树脂粘合膜（NCF）将半导体芯片通过倒装芯片安装在基板上，并防止NCF的溢出以及在热处理期间凸块和电极之间的绝缘树脂或无机填料的介入 紧迫。 该方法还包括临时固定尺寸的NCF，其尺寸基本上为周边排列布置的半导体芯片的多个凸块所包围的区域的面积的60〜100％，并且具有最小熔体粘度为2×102〜 1×105Pa·s，与由凸块相对应的多个基板的电极所围成的区域，使半导体芯片和基板彼此对准，使凸块和与其对应的电极相互对置。

公开(公告)号：US20100290205A1

公开(公告)日：2010-11-18

申请号：US12811599

申请日：2009-03-31

申请人： Yasuhiro Suga

发明人： Yasuhiro Suga

IPC分类号： H05K7/00 ,  H01B1/22

CPC分类号： H05K3/323 ,  C08K3/36 ,  C08K9/04 ,  C09J163/00 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0209 ,  H05K2201/0221 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An adhesive film is provided that can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of a filler contained with respect to a total amount of an epoxy compound, a curing agent, and the filler is 10 to 70 mass %. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 μm, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 μm. An average particle size of the conductive particles does not exceed 1.5 μm. The conductive particles is contained in an amount of 10 to 60 mass % of the filler.

摘要翻译： 即使在半导体芯片的倒装芯片安装期间填充剂和粘合剂组合物在布线板和半导体芯片之间没有被充分地去除，也可以确保可靠的连续性。 粘合膜由包含环氧化合物，固化剂和填料的粘合剂组合物形成。 相对于环氧化合物，固化剂和填料的总量，填充剂的含量为10〜70质量％。 填料包括平均粒径为0.5〜1.0μm的第一非导电性无机粒子，以及通过使平均粒径为0.5〜1.0μm的第二非导电性无机粒子形成的导电粒子。 导电粒子的平均粒径不超过1.5μm。 导电性颗粒的含量为填料的10〜60质量％。

公开(公告)号：US07703657B2

公开(公告)日：2010-04-27

申请号：US12466977

申请日：2009-05-15

申请人： Takashi Matsumura ,  Hisashi Ando ,  Shiyuki Kanisawa ,  Yasuhiro Suga ,  Noriaki Kudo

发明人： Takashi Matsumura ,  Hisashi Ando ,  Shiyuki Kanisawa ,  Yasuhiro Suga ,  Noriaki Kudo

IPC分类号： B23K37/00

CPC分类号： B30B5/02 ,  B30B15/065 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

摘要翻译： 提供了一种安装方法和安装装置，其可以通过使用粘合剂来安装具有高可靠性的电气部件。 安装方法包括通过使用各向异性导电粘合剂膜将IC芯片热压接合到布线板上。 在热压接期间，IC芯片的顶部区域以预定的压力压在布线板上，并且IC芯片的侧面区域以比被施加到IC芯片的顶部区域的压力更小的压力被按压。 橡胶硬度为40以上且80以下的弹性体用于热压接头的压接部。 无纺布导电性粘合膜含有熔融粘度为1.0×10 2 mPa·s以上且1.0×10 5 mPa·s以下的粘结树脂。

公开(公告)号：US06426021B2

公开(公告)日：2002-07-30

申请号：US09809279

申请日：2001-03-16

申请人： Yasuhiro Suga ,  Motohide Takeichi

发明人： Yasuhiro Suga ,  Motohide Takeichi

IPC分类号： H01B102

CPC分类号： H01L24/28 ,  C08L2666/54 ,  C09J5/06 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10674 ,  Y10T428/24917 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/3512

摘要： An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (E′) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1) 0.02≦E/E′≦0/5  (1)

摘要翻译： 各向异性导电粘合剂材料由热固性树脂和分散在热固性树脂中的导电颗粒构成，其中导电颗粒中10％的压缩弹性模量（E）和突出电极的纵向弹性模量（E'） 通过各向异性导电粘合剂材料连接的电子元件满足下述关系式（1）

公开(公告)号：US06376050B1

公开(公告)日：2002-04-23

申请号：US09471241

申请日：1999-12-23

申请人： Tohru Terasaki ,  Noriyuki Honda ,  Seiichi Miyachi ,  Yasuhiro Suga

发明人： Tohru Terasaki ,  Noriyuki Honda ,  Seiichi Miyachi ,  Yasuhiro Suga

IPC分类号： B32B516

CPC分类号： H05K3/323 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H01R12/57 ,  H05K7/1061 ,  H05K2201/10674 ,  H05K2203/1189 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00

摘要： An electrically connecting device and an electrical connecting method in which electrical connections can be positively realized via electrically conductive particles despite slight irregularities of objects to be eclectically connected to each other. The electrical connecting device 100 electrically connects an electrically connection portion 5 of the first object and the electrically connection portion 3 of the second object. The electrical connecting device 100 is made up of a first film-shaped adhesive layer 6 and a second film-shaped adhesive layer 9. The first film-shaped adhesive layer 6, arranged on the first object 4, is made up of plural electrically conductive particles 7 and a binder 8 containing the electrically conductive particles 7. The second film-shaped adhesive layer 9, arranged on the first film-shaped adhesive layer 6 containing the electrically conductive particles, is made up only of a fluid binder.

摘要翻译： 电气连接装置和电气连接方法，其中通过导电颗粒可以积极地实现电连接，尽管物体彼此轻微不规则地彼此连接。 电连接装置100电连接第一物体的电连接部分5和第二物体的电连接部分3。 电连接装置100由第一膜状粘合层6和第二膜状粘合层9构成。配置在第一物体4上的第一膜状粘合剂层6由多个导电性 颗粒7和含有导电颗粒7的粘合剂8.布置在包含导电颗粒的第一膜状粘合剂层6上的第二膜状粘合剂层9仅由流体粘合剂构成。

公开(公告)号：US06365840B1

公开(公告)日：2002-04-02

申请号：US09362057

申请日：1999-07-28

申请人： Noriyuki Honda ,  Yasuhiro Suga

发明人： Noriyuki Honda ,  Yasuhiro Suga

IPC分类号： H05K116

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/29 ,  H01L24/31 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29017 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).