发明申请
- 专利标题： STRUCTURE FOR MOUNTING SEMICONDUCTOR PACKAGE
- 专利标题（中）： 用于安装半导体封装的结构
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申请号： US12525957申请日： 2007-11-30
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公开(公告)号： US20100309635A1公开(公告)日： 2010-12-09
- 发明人: Junichi Sasaki , Tomoyuki Hino
- 申请人： Junichi Sasaki , Tomoyuki Hino
- 优先权： JP2007-035101 20070215
- 国际申请： PCT/JP2007/073200 WO 20071130
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01L23/40
摘要：
A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.
公开/授权文献
- US07983048B2 Structure for mounting semiconductor package 公开/授权日：2011-07-19
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