发明申请
- 专利标题： METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 制造半导体器件的方法
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申请号： US12789957申请日： 2010-05-28
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公开(公告)号： US20100311234A1公开(公告)日： 2010-12-09
- 发明人: Yukinori Tabira
- 申请人： Yukinori Tabira
- 专利权人： NEC Electronics Corporation
- 当前专利权人： NEC Electronics Corporation
- 优先权： JP2009-138689 20090609
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; B23K31/02 ; B23K37/04 ; B23K37/00
摘要：
A method of manufacturing a semiconductor device is provided. A first bond of a first wire loop is formed. A wire is bonded through a ball to a lead or a chip electrode of a semiconductor chip to form a second bond of the first wire loop and a first bond of a second wire loop. A second bond of the second wire loop is formed. The ball provides a large bonding area, and thus, provides a strong bonding strength.
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