THIN-FILM LED WITH P AND N CONTACTS ELECTRICALL ISOLATED FROM THE SUBSTRATE

Invention Application

US20100314649A1 THIN-FILM LED WITH P AND N CONTACTS ELECTRICALL ISOLATED FROM THE SUBSTRATE 审中-公开

Title translation: 带有P和N触点的薄膜LED从基板电隔离

Patent Title: THIN-FILM LED WITH P AND N CONTACTS ELECTRICALL ISOLATED FROM THE SUBSTRATE
Patent Title (中): 带有P和N触点的薄膜LED从基板电隔离
Application No.: US12790597

Application Date: 2010-05-28
Publication No.: US20100314649A1

Publication Date: 2010-12-16
Inventor: Chao-Kun LIN
Applicant: Chao-Kun LIN
Applicant Address: US CA Livermore
Assignee: Bridgelux, Inc.
Current Assignee: Bridgelux, Inc.
Current Assignee Address: US CA Livermore
Main IPC: H01L33/10
IPC: H01L33/10 ; H01L33/22

Abstract:

A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode.

Abstract(Chinese):

薄膜LED包括绝缘基板，绝缘基板上的电极和电极上的外延结构。

Information query

Global Dossier Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L33/00	至少有一个电位跃变势垒或表面势垒的专门适用于光发射的半导体器件；专门适用于制造或处理这些半导体器件或其部件的方法或设备；这些半导体器件的零部件（H01L51/00优先；由在一个公共衬底中或其上形成有多个半导体组件并包括具有至少一个电位跃变势垒或表面势垒，专门适用于光发射的器件入H01L27/15；半导体激光器入H01S5/00）
H01L33/02	.以半导体为特征的
H01L33/10	..具有一个光反射结构，例如半导体布拉格反射镜