Invention Application
US20100320081A1 APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING
审中-公开
用于增强金属填充物预处理的装置
- Patent Title: APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING
- Patent Title (中): 用于增强金属填充物预处理的装置
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Application No.: US12684792Application Date: 2010-01-08
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Publication No.: US20100320081A1Publication Date: 2010-12-23
- Inventor: Steven T. Mayer , David W. Porter , Mark J. Willey
- Applicant: Steven T. Mayer , David W. Porter , Mark J. Willey
- Main IPC: C25B9/00
- IPC: C25B9/00 ; B08B3/00
Abstract:
Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.
Information query
