发明申请
- 专利标题: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- 专利标题(中): 基板加工方法和基板加工装置
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申请号: US12821456申请日: 2010-06-23
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公开(公告)号: US20100325913A1公开(公告)日: 2010-12-30
- 发明人: Xinming WANG , Kazuo Yamauchi , Akira Kodera , Tsukuru Suzuki , Yasushi Toma , Takayuki Saito , Hirokuni Hiyama
- 申请人: Xinming WANG , Kazuo Yamauchi , Akira Kodera , Tsukuru Suzuki , Yasushi Toma , Takayuki Saito , Hirokuni Hiyama
- 优先权: JP2009-153289 20090629
- 主分类号: F26B7/00
- IPC分类号: F26B7/00
摘要:
A substrate processing method dose not use or only use the least possible amount of an organic solvent, and can quickly and completely remove a liquid from a wet substrate surface without allowing the liquid to remain on the substrate surface. The substrate processing method for drying a substrate surface which is wet with a liquid, includes: removing the liquid from the substrate surface and sucking the liquid together with its surrounding gas into a gas/liquid suction nozzle, disposed opposite the substrate surface, while relatively moving the gas/liquid suction nozzle and the substrate parallel to each other; and blowing a dry gas from a dry gas supply nozzle, disposed opposite the substrate surface, toward that area of the substrate surface from which the liquid has been removed while relatively moving the dry gas supply nozzle and the substrate parallel to each other.