发明申请
- 专利标题: SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- 专利标题(中): 固体电解电容器及其制造方法
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申请号: US12866926申请日: 2009-02-17
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公开(公告)号: US20100328847A1公开(公告)日: 2010-12-30
- 发明人: Takashi Umemoto , Masaaki Nemoto , Hiroshi Nonoue
- 申请人: Takashi Umemoto , Masaaki Nemoto , Hiroshi Nonoue
- 申请人地址: JP Moriguchi-city
- 专利权人: SANYO ELECTRIC CO., LTD.
- 当前专利权人: SANYO ELECTRIC CO., LTD.
- 当前专利权人地址: JP Moriguchi-city
- 优先权: JP2008-039997 20080221
- 国际申请: PCT/JP2009/000624 WO 20090217
- 主分类号: H01G9/08
- IPC分类号: H01G9/08 ; H01G9/15 ; H01G9/025 ; B05D5/12
摘要:
To reduce the increase in leakage current in a molding process. A solid electrolytic capacitor includes: an anode 3 formed from a valve metal or an alloy thereof; an anode lead 2 partly embedded in the anode 3; a dielectric layer 4 provided on the surface of the anode 3; an electrolyte layer 5 provided on the surface of the dielectric layer 4; a cathode layer 6 provided on a part of the electrolyte layer 5 lying on the external surface of the anode 3; and a resin outer package 8 formed to cover a capacitor element formed of the anode 3 in which a part of the anode lead 2 is embedded and on which the dielectric layer 4, the electrolyte layer 5 and the cathode layer 6 are formed, wherein the solid electrolytic capacitor further includes: a first resin layer 10 provided to cover parts of the dielectric layer 4 and the electrolyte layer 5 located at the root 2a of an extension of the anode lead 2 and on a neighboring part of the extension; and a second resin layer 11 provided to cover the first resin layer 10, and the second resin layer 11 is formed from a resin having a smaller flexural modulus than a resin forming the first resin layer 10.
公开/授权文献
- US1824863A Packing gland 公开/授权日:1931-09-29
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