发明申请
- 专利标题： METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
- 专利标题（中）： 垂直柱连接的方法和结构
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申请号： US12828003申请日： 2010-06-30
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公开(公告)号： US20110003470A1公开(公告)日： 2011-01-06
- 发明人: Guy F. Burgess , Anthony Curtis , Michael E. Johnson , Gene Stout , Theodore G. Tessier
- 申请人： Guy F. Burgess , Anthony Curtis , Michael E. Johnson , Gene Stout , Theodore G. Tessier
- 申请人地址： US AZ Phoenix
- 专利权人： FlipChip International, LLC
- 当前专利权人： FlipChip International, LLC
- 当前专利权人地址： US AZ Phoenix
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
In wafer-level chip-scale packaging and flip-chip packaging and assemblies, a solder cap is formed on a vertical pillar. In one embodiment, the vertical pillar overlies a semiconductor substrate. A solder paste, which may be doped with at least one trace element, is applied on a top surface of the pillar structure. A reflow process is performed after applying the solder paste to provide the solder cap.