Invention Application
- Patent Title: CONDUCTIVE POLYMER FOAMS, METHOD OF MANUFACTURE, AND USES THEREOF
- Patent Title (中): 导电聚合物,其制造方法及其用途
-
Application No.: US12027026Application Date: 2008-02-06
-
Publication No.: US20110006267A1Publication Date: 2011-01-13
- Inventor: Scott Simpson , Ki-Soo Kim , Jason Hoffman
- Applicant: Scott Simpson , Ki-Soo Kim , Jason Hoffman
- Applicant Address: US IL Lincolnwood
- Assignee: WORLD PROPERTIES, INC.
- Current Assignee: WORLD PROPERTIES, INC.
- Current Assignee Address: US IL Lincolnwood
- Main IPC: H01B1/16
- IPC: H01B1/16 ; H01B1/14

Abstract:
Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of electrically conductive particles aligned into a plurality of columns that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.
Public/Granted literature
- US07875345B1 Conductive polymer foams, method of manufacture, and uses thereof Public/Granted day:2011-01-25
Information query