发明申请
- 专利标题: Coupling Well Structure for Improving HVMOS Performance
- 专利标题(中): 耦合井结构提高HVMOS性能
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申请号: US12887300申请日: 2010-09-21
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公开(公告)号: US20110006366A1公开(公告)日: 2011-01-13
- 发明人: Hsueh-Liang Chou , Chen-Bau Wu , Weng-Chu Chu , Tsung-Yi Huang , Fu-Jier Fan
- 申请人: Hsueh-Liang Chou , Chen-Bau Wu , Weng-Chu Chu , Tsung-Yi Huang , Fu-Jier Fan
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L29/78
- IPC分类号: H01L29/78
摘要:
A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
公开/授权文献
- US08049295B2 Coupling well structure for improving HVMOS performance 公开/授权日:2011-11-01
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