发明申请
- 专利标题： SOLDER INTERCONNECT BY ADDITION OF COPPER
- 专利标题（中）： 通过添加铜的焊接互连
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申请号： US12501686申请日： 2009-07-13
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公开(公告)号： US20110006415A1公开(公告)日： 2011-01-13
- 发明人: Mark A. Bachman , John W. Osenbach , Kishor V. Desai
- 申请人： Mark A. Bachman , John W. Osenbach , Kishor V. Desai
- 申请人地址： US CA Milpitas
- 专利权人： LSI Corporation
- 当前专利权人： LSI Corporation
- 当前专利权人地址： US CA Milpitas
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/60 ; H01L23/488
摘要：
A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A copper-containing layer is formed on the nickel-containing layer prior to subjecting the electronic device to a reflow process.
公开/授权文献
- US08378485B2 Solder interconnect by addition of copper 公开/授权日：2013-02-19
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