发明申请
US20110006432A1 RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
有权
采用后置垫片延伸的重新构造的堆叠包装
- 专利标题： RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
- 专利标题（中）： 采用后置垫片延伸的重新构造的堆叠包装
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申请号： US12670952申请日： 2008-07-25
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公开(公告)号： US20110006432A1公开(公告)日： 2011-01-13
- 发明人: Belgacem Haba , Giles Humpston , David Ovrutsky , Laura Mirkarimi
- 申请人： Belgacem Haba , Giles Humpston , David Ovrutsky , Laura Mirkarimi
- 申请人地址： US CA San Jose
- 专利权人： TESSERA, INC.
- 当前专利权人： TESSERA, INC.
- 当前专利权人地址： US CA San Jose
- 国际申请： PCT/US2008/009207 WO 20080725
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/50
摘要：
A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.
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