发明申请
US20110006860A1 FILM BULK ACOUSTIC RESONATOR, FILTER, COMMUNICATION MODULE AND COMMUNICATION APPARATUS
有权
电影大容量声学谐振器,滤波器,通信模块和通信设备
- 专利标题: FILM BULK ACOUSTIC RESONATOR, FILTER, COMMUNICATION MODULE AND COMMUNICATION APPARATUS
- 专利标题(中): 电影大容量声学谐振器,滤波器,通信模块和通信设备
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申请号: US12921150申请日: 2008-03-04
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公开(公告)号: US20110006860A1公开(公告)日: 2011-01-13
- 发明人: Motoaki Hara , Tokihiro Nishihara , Shinji Taniguchi , Takeshi Sakashita , Tsuyoshi Yokoyama , Masafumi Iwaki , Masanori Ueda
- 申请人: Motoaki Hara , Tokihiro Nishihara , Shinji Taniguchi , Takeshi Sakashita , Tsuyoshi Yokoyama , Masafumi Iwaki , Masanori Ueda
- 申请人地址: JP Tokyo
- 专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人地址: JP Tokyo
- 国际申请: PCT/JP2008/053828 WO 20080304
- 主分类号: H03H9/17
- IPC分类号: H03H9/17 ; H01L41/053
摘要:
A piezoelectric thin film resonator of the present has a substrate 1, an intermediate layer 7 disposed on the substrate 1 and is formed of an insulator, a lower electrode 3 disposed on the intermediate layer 7, a piezoelectric film 4 disposed on the lower electrode 3, and an upper electrode 5 disposed on a position facing the lower electrode 3 with the piezoelectric film 4 interposed therebetween, in which, in a resonant region 8 where the lower electrode 3 and the upper electrode 5 face each other, a space 6 is formed in the substrate 1 and the intermediate layer 7 or between the lower electrode 3 and the intermediate layer 7 and the region of the space 6 is included in the resonant region 8. With the structure, the dissipation of the vibrational energy to the substrate from the resonance portion can be suppressed, thereby improving the quality factor.
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