In a method of separating wafers (12) from a vertical wafer stack (16), the wafers (12) are transported away individually from above via movement means (23). The movement means (23) include circulating belts (24), with a suction surface (25) against which the uppermost wafer (12) abuts, the abutment of the wafer against the suction surface (25) being enhanced by negative pressure. To separate a plurality of wafers (12) located one upon another, the movement means (23) are subjected to at least one of the following two steps: a) water (30) is forcefully jetted against the leading edge of the uppermost wafer (12), the water being directed obliquely from beneath the latter, or b) the movement means (23) guide the wafer (12) over a stripping device (32) which butts against the underside of the moving wafer and both forces the wafer against the suction surface (25) and generates a braking action thereon. Thereafter, the wafer (12) is moved to a transporting path (35, 37) to be transported for further processing.