A bonding apparatus for bonding a first substrate and a second substrate includes a base body, a first stripping device, a second stripping device, at least two vacuum bonding devices, and a loading mechanism. The first stripping device removes a film from the first substrate, and the second stripping device removes a film from the second substrate. The at least two vacuum bonding devices are arranged on the base body and aligned with each other. The loading mechanism includes a slide-rail on the base body and an adjustment assembly slidably connected to the slide-rail. The loading mechanism transfers a first substrate and a second substrate into one vacuum bonding device, and then, sliding on the slider, transfers another first substrate and another second substrate to another vacuum bonding device.