发明申请
- 专利标题： COUPON BOARD AND MANUFACTURING METHOD OF PRINTED BOARD
- 专利标题（中）： 印刷板的制造和制造方法
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申请号： US12828776申请日： 2010-07-01
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公开(公告)号： US20110018552A1公开(公告)日： 2011-01-27
- 发明人: Kaoru Sugimoto , Katsuhiko Kobayashi
- 申请人： Kaoru Sugimoto , Katsuhiko Kobayashi
- 申请人地址： JP Kawasaki-shi
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki-shi
- 优先权： JP2009-174570 20090727
- 主分类号： H01H31/02
- IPC分类号： H01H31/02 ; B05D5/12
摘要：
A coupon board is cut out together with a printed wiring board from a sheet material in which a solder resist film is formed on a surface of a glass cloth fiber. The coupon board is for evaluating characteristics of the printed wiring board. The coupon board includes a region on which the solder resist film is not formed, and which extends parallel with one side of the printed wiring board.
公开/授权文献
- US08451010B2 Coupon board and manufacturing method of printed board 公开/授权日：2013-05-28
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