发明申请
- 专利标题: CAMERA MODULE FABRICATING METHOD AND CAMERA MODULE
- 专利标题(中): 相机模块制作方法和相机模块
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申请号: US12836159申请日: 2010-07-14
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公开(公告)号: US20110019077A1公开(公告)日: 2011-01-27
- 发明人: Masaru Kobayashi , Katsuo Iwata , Toyokazu Aizawa , Takehiro Hiramatsu , Takuro Obara , Tatsuhiko Hagihara , Hiromichi Kobayashi , Shinichi Nitta , Manabu Yamada , Yasunari Fujii
- 申请人: Masaru Kobayashi , Katsuo Iwata , Toyokazu Aizawa , Takehiro Hiramatsu , Takuro Obara , Tatsuhiko Hagihara , Hiromichi Kobayashi , Shinichi Nitta , Manabu Yamada , Yasunari Fujii
- 申请人地址: JP Tokyo
- 专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-171476 20090722
- 主分类号: H04N5/225
- IPC分类号: H04N5/225 ; H01L31/18
摘要:
There is disclosed a method for fabricating a camera module includes the steps of: disposing a camera module body inside of a die; filling the die with a resin blocking a light; curing the resin; and removing the camera module body and the resin from the die. Here, disposing the camera module body inside of the die is disposing the camera module body having a lens holder secured on a sensor board inside of the die in such a manner that the side surface of the camera module body is not brought into contact with the side surface of the die. Filling the die with the resin is covering the upper end of the die with a lid so as to closely enclose the inside of the die, followed by filling the die with the resin. Taking the camera module body and the resin from the die is taking, from the die, the camera module body and the resin formed around the camera module body in close contact.