发明申请
US20110024906A1 SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD FOR FABRICATING A DEVICE
有权
半导体芯片封装，半导体芯片组件和用于制造器件的方法
- 专利标题： SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD FOR FABRICATING A DEVICE
- 专利标题（中）： 半导体芯片封装，半导体芯片组件和用于制造器件的方法
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申请号： US12899642申请日： 2010-10-07
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公开(公告)号： US20110024906A1公开(公告)日： 2011-02-03
- 发明人: Thorsten Meyer , Markus Brunnbauer , Jens Pohl
- 申请人： Thorsten Meyer , Markus Brunnbauer , Jens Pohl
- 申请人地址： DE Muenchen
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Muenchen
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50
摘要：
A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.
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