Invention Application
- Patent Title: Method of Fabricating Porous Soundproof Board
- Patent Title (中): 多孔隔音板的制作方法
-
Application No.: US12533507Application Date: 2009-07-31
-
Publication No.: US20110024955A1Publication Date: 2011-02-03
- Inventor: Sheng-Fu YANG , To-Mai Wang , Chun-Yen Yeh , Wen-Cheng Lee , Kin-Seng Sun , Chin-Ching Tzeng
- Applicant: Sheng-Fu YANG , To-Mai Wang , Chun-Yen Yeh , Wen-Cheng Lee , Kin-Seng Sun , Chin-Ching Tzeng
- Applicant Address: TW Taoyuan
- Assignee: ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCH
- Current Assignee: ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCH
- Current Assignee Address: TW Taoyuan
- Main IPC: C04B35/64
- IPC: C04B35/64
Abstract:
A porous soundproof board is fabricated Recycled waste, like slag, is used for fabrication. Slag and ceramics are mixed to be poured into a network foam carrier. Then, the soundproof board is fabricated through sintering. Thus the board fabricated has great added values and is environmental protected with low cost.
Information query
IPC分类:
