发明申请
- 专利标题： Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
- 专利标题（中）： 热固性树脂组合物，环氧树脂成型材料和多元羧酸缩合物
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申请号： US12805445申请日： 2010-07-30
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公开(公告)号： US20110031527A1公开(公告)日： 2011-02-10
- 发明人: Hayato Kotani , Naoyuki Urasaki , Makoto Mizutani
- 申请人： Hayato Kotani , Naoyuki Urasaki , Makoto Mizutani
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 优先权： JPP2008-002128 20080109; JPP2008-004297 20080111; JPP2008-248711 20080926; JPP2008-257593 20081002
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; C08G59/14 ; C08L63/00 ; C08K3/22 ; C07C69/74 ; C07D307/77 ; C09K3/00 ; C08G69/26 ; C08G63/00
摘要：
The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.
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