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    OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME
    5.
    发明申请
    OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME 有权
    光学半导体元件安装封装和使用其的光学半导体器件

    公开(公告)号：US20110241055A1

    公开(公告)日：2011-10-06

    申请号：US13160680

    申请日：2011-06-15

    申请人： Naoyuki Urasaki ,  Kanako Yuasa

    发明人： Naoyuki Urasaki ,  Kanako Yuasa

    IPC分类号： H01L33/60

    CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

    摘要翻译： 提供了一种光学半导体元件安装封装，其具有树脂模制品和引线电极之间良好的粘合性并且具有优异的可靠性，并且还提供了使用该封装的光学半导体器件。 所述光半导体元件安装封装具有作为光半导体元件安装区域的凹部，其特征在于，所述封装通过以下方式形成：将由热固性光反射树脂组合物构成的树脂成形体形成为至少形成所述 凹陷部分 以及至少一对彼此相对设置的正极和负极引线电极，以形成凹部的底面的一部分，并且在树脂模制品和引线电极之间的接合面处没有间隙。

    WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION OF THE SAME
    10.
    发明申请
    WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION OF THE SAME 审中-公开
    接线板，电子设备包装及其生产方法

    公开(公告)号：US20110297424A1

    公开(公告)日：2011-12-08

    申请号：US13202800

    申请日：2010-02-22

    申请人： Hideki Yoshida ,  Satoshi Isoda ,  Naoyuki Urasaki ,  Hayato Kotani

    发明人： Hideki Yoshida ,  Satoshi Isoda ,  Naoyuki Urasaki ,  Hayato Kotani

    IPC分类号： H05K1/02 ,  H05K3/02

    CPC分类号： G02B5/12 ,  G02F1/133553 ,  G02F1/136286 ,  G02F2203/12 ,  H05K1/0274 ,  H05K3/244 ,  H05K3/28 ,  H05K3/285 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/025 ,  Y10T29/49156

    摘要： A wiring board which uses both conductor patterns and reflection members provided at gaps therebetween to suppress unevenness in the reflection rate so as to raise the overall reflection rate and provide a reflection function on the surface of the wiring board at the side where an electronic device is mounted; facilitates shaping of the reflection members, controlling of the thickness of the reflection members, and controlling of the surface shape of the reflection members so as to stabilize the reflection rate; and secures close contact between the reflection members and sealing members so as to improve reliability. The wiring board comprises a plurality of wiring layers provided with conductor patterns disposed on base members, and base members which electrically insulate the plurality of wiring layers. At the outermost wiring layer among the plurality of wiring layers, reflection members are formed on the portions of the base member where there are no conductor patterns, the surface of these reflection members and the surface of the conductor patterns are made level and the surface of the conductor patterns are exposed from the reflection members.

    摘要翻译： 一种布线板，其使用两个导体图案和设置在其间的间隙的反射构件，以抑制反射率的不均匀性，以提高整体反射率，并且在电子设备的一侧在布线板的表面上提供反射功能 安装; 有助于反射构件的成形，反射构件的厚度的控制，以及反射构件的表面形状的控制以使反射率稳定; 并且确保反射构件和密封构件之间的紧密接触，从而提高可靠性。 布线板包括设置在基底构件上的导体图案的多个布线层和使多个布线层电绝缘的基底构件。 在多个布线层中的最外面布线层处，在不存在导体图形的基底部件上形成有反射部件，这些反射部件的表面和导体图案的表面形成为水平面， 导体图案从反射构件露出。